Failure Summary
State failure mode, source, customer or lot reference, symptom, quantity affected, and urgency.
4.8
on G2
Free Semiconductor & Electronics Template
Document electrical, physical, and root cause analysis for failed devices or assemblies
Use this template to document electrical, physical, and root cause analysis for failed devices or assemblies.
| Field | Details |
|---|---|
| Category | Semiconductor & Electronics |
| Owner | [Team or owner] |
| Version | [Version number] |
| Effective Date | [Date] |
| Review Cycle | [Monthly / Quarterly / Annual / Event-based] |
| Status | [Draft / In Review / Approved] |
State failure mode, source, customer or lot reference, symptom, quantity affected, and urgency.
| Item | Details | Owner | Status |
|---|---|---|---|
| [Item or requirement] | [Describe the relevant detail, evidence, or decision] | [Owner] | [Open / Complete] |
| [Item or requirement] | [Describe the relevant detail, evidence, or decision] | [Owner] | [Open / Complete] |
[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]
List device, package, date code, lot, serial numbers, handling condition, and chain of custody.
| Item | Details | Owner | Status |
|---|---|---|---|
| [Item or requirement] | [Describe the relevant detail, evidence, or decision] | [Owner] | [Open / Complete] |
| [Item or requirement] | [Describe the relevant detail, evidence, or decision] | [Owner] | [Open / Complete] |
[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]
Summarize curve trace, ATE retest, bench measurement, thermal, or X-ray screening results.
| Item | Details | Owner | Status |
|---|---|---|---|
| [Item or requirement] | [Describe the relevant detail, evidence, or decision] | [Owner] | [Open / Complete] |
| [Item or requirement] | [Describe the relevant detail, evidence, or decision] | [Owner] | [Open / Complete] |
[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]
Document decapsulation, cross-section, SEM/EDS, acoustic microscopy, dye-and-pry, or microscopy evidence.
| Item | Details | Owner | Status |
|---|---|---|---|
| [Item or requirement] | [Describe the relevant detail, evidence, or decision] | [Owner] | [Open / Complete] |
| [Item or requirement] | [Describe the relevant detail, evidence, or decision] | [Owner] | [Open / Complete] |
[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]
Link the confirmed or most probable cause to evidence and reject unsupported hypotheses.
| Item | Details | Owner | Status |
|---|---|---|---|
| [Item or requirement] | [Describe the relevant detail, evidence, or decision] | [Owner] | [Open / Complete] |
| [Item or requirement] | [Describe the relevant detail, evidence, or decision] | [Owner] | [Open / Complete] |
[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]
Assign containment, process correction, design update, supplier action, and verification owners.
| Item | Details | Owner | Status |
|---|---|---|---|
| [Item or requirement] | [Describe the relevant detail, evidence, or decision] | [Owner] | [Open / Complete] |
| [Item or requirement] | [Describe the relevant detail, evidence, or decision] | [Owner] | [Open / Complete] |
[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]
State return, scrap, rework, customer response, and retained evidence location. Keep the report factual, concise, and traceable to tested evidence.
| Item | Details | Owner | Status |
|---|---|---|---|
| [Item or requirement] | [Describe the relevant detail, evidence, or decision] | [Owner] | [Open / Complete] |
| [Item or requirement] | [Describe the relevant detail, evidence, or decision] | [Owner] | [Open / Complete] |
[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]
Document review conclusions, approvals, unresolved items, and next review date.
| Role | Name | Date | Notes |
|---|---|---|---|
| Preparer | [Name] | [Date] | [Notes] |
| Reviewer | [Name] | [Date] | [Notes] |
| Approver | [Name] | [Date] | [Notes] |
Template Structure
Use this semiconductor & electronics template as a starting point, then customize each section to match your internal workflow, evidence, and signoff needs.
State failure mode, source, customer or lot reference, symptom, quantity affected, and urgency.
List device, package, date code, lot, serial numbers, handling condition, and chain of custody.
Summarize curve trace, ATE retest, bench measurement, thermal, or X-ray screening results.
Document decapsulation, cross-section, SEM/EDS, acoustic microscopy, dye-and-pry, or microscopy evidence.
Link the confirmed or most probable cause to evidence and reject unsupported hypotheses.
Assign containment, process correction, design update, supplier action, and verification owners.
State return, scrap, rework, customer response, and retained evidence location. Keep the report factual, concise, and traceable to tested evidence.
Write a semiconductor/electronics failure analysis report. Structure with these Markdown sections:
State failure mode, source, customer or lot reference, symptom, quantity affected, and urgency.
List device, package, date code, lot, serial numbers, handling condition, and chain of custody.
Summarize curve trace, ATE retest, bench measurement, thermal, or X-ray screening results.
Document decapsulation, cross-section, SEM/EDS, acoustic microscopy, dye-and-pry, or microscopy evidence.
Link the confirmed or most probable cause to evidence and reject unsupported hypotheses.
Assign containment, process correction, design update, supplier action, and verification owners.
State return, scrap, rework, customer response, and retained evidence location.
Keep the report factual, concise, and traceable to tested evidence.
Symptom: No high-side output on customer board return RMA-4219.
Quantity: 2 failed units from date code 2614A.
ATE retest confirmed leakage on HO pin above 2 mA at 12 V. Curve trace showed low impedance to VS.
Decapsulation found EOS damage near the HO bond pad. SEM showed localized metal melt with no bond lift.
Probable electrical overstress during board-level inductive load switching. No fab defect evidence was found.
Retain Unit 2 cross-section samples in FA cabinet shelf B for customer review.
Record a walkthrough, training session, or process demonstration. Docsie AI turns it into structured documentation using this template as the starting framework.
Use the template manually, or let Docsie generate the first draft from source footage.
Track die attach, wire bond, mold, singulation, inspection, and release steps for IC assembly
Define device burn-in loading, stress conditions, monitoring, unload, and disposition
Define gowning, behavior, and contamination controls for [cleanroom area]
Create a concise semiconductor device datasheet with ratings, electrical characteristics, timing, and package data
Define electrostatic discharge controls for [electronics line/lab/fab area]
Control semiconductor or electronics product, process, test, material, or documentation changes
Template FAQ
Common questions about using and generating a failure Analysis Report.
Q: What is a failure Analysis Report?
A: A failure Analysis Report is a structured document for document electrical, physical, and root cause analysis for failed devices or assemblies.
Q: Can I download this failure Analysis Report as Word or PDF?
A: Yes. This page includes free downloads in DOCX, PDF, and Markdown formats so you can edit, share, or import the template into your documentation system.
Q: Can Docsie generate this from a video?
A: Yes. Upload a process walkthrough, training recording, or screen capture to Docsie, then use this template structure to generate a first draft automatically.