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Free Semiconductor & Electronics Template

Free Failure Analysis Report Template

Download a free failure analysis report template in Word, PDF, or Markdown. Or turn any video into failure analysis report template with Docsie AI — auto-fills every required field.

Failure Summary Sample Information Electrical Findings Physical Analysis Root Cause Corrective Actions Disposition

Failure Analysis Report

Use this template to document electrical, physical, and root cause analysis for failed devices or assemblies.

Template Metadata

Field Details
Category Semiconductor & Electronics
Owner [Team or owner]
Version [Version number]
Effective Date [Date]
Review Cycle [Monthly / Quarterly / Annual / Event-based]
Status [Draft / In Review / Approved]

Failure Summary

State failure mode, source, customer or lot reference, symptom, quantity affected, and urgency.

Item Details Owner Status
[Item or requirement] [Describe the relevant detail, evidence, or decision] [Owner] [Open / Complete]
[Item or requirement] [Describe the relevant detail, evidence, or decision] [Owner] [Open / Complete]

Notes

[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]

Sample Information

List device, package, date code, lot, serial numbers, handling condition, and chain of custody.

Item Details Owner Status
[Item or requirement] [Describe the relevant detail, evidence, or decision] [Owner] [Open / Complete]
[Item or requirement] [Describe the relevant detail, evidence, or decision] [Owner] [Open / Complete]

Notes

[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]

Electrical Findings

Summarize curve trace, ATE retest, bench measurement, thermal, or X-ray screening results.

Item Details Owner Status
[Item or requirement] [Describe the relevant detail, evidence, or decision] [Owner] [Open / Complete]
[Item or requirement] [Describe the relevant detail, evidence, or decision] [Owner] [Open / Complete]

Notes

[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]

Physical Analysis

Document decapsulation, cross-section, SEM/EDS, acoustic microscopy, dye-and-pry, or microscopy evidence.

Item Details Owner Status
[Item or requirement] [Describe the relevant detail, evidence, or decision] [Owner] [Open / Complete]
[Item or requirement] [Describe the relevant detail, evidence, or decision] [Owner] [Open / Complete]

Notes

[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]

Root Cause

Link the confirmed or most probable cause to evidence and reject unsupported hypotheses.

Item Details Owner Status
[Item or requirement] [Describe the relevant detail, evidence, or decision] [Owner] [Open / Complete]
[Item or requirement] [Describe the relevant detail, evidence, or decision] [Owner] [Open / Complete]

Notes

[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]

Corrective Actions

Assign containment, process correction, design update, supplier action, and verification owners.

Item Details Owner Status
[Item or requirement] [Describe the relevant detail, evidence, or decision] [Owner] [Open / Complete]
[Item or requirement] [Describe the relevant detail, evidence, or decision] [Owner] [Open / Complete]

Notes

[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]

Disposition

State return, scrap, rework, customer response, and retained evidence location. Keep the report factual, concise, and traceable to tested evidence.

Item Details Owner Status
[Item or requirement] [Describe the relevant detail, evidence, or decision] [Owner] [Open / Complete]
[Item or requirement] [Describe the relevant detail, evidence, or decision] [Owner] [Open / Complete]

Notes

[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]

Review and Signoff

Document review conclusions, approvals, unresolved items, and next review date.

Role Name Date Notes
Preparer [Name] [Date] [Notes]
Reviewer [Name] [Date] [Notes]
Approver [Name] [Date] [Notes]
Template Guide

How to Use the Failure Analysis Report Template

When to Use This Template

Deploy this template when semiconductor or electronics components fail during testing, manufacturing, or field operation and require documented root cause analysis.

  • Customer return or RMA requires failure mode identification
  • ATE or burn-in testing flags yield excursions or outliers
  • Supplier quality audit or AS9100/IATF 16949 corrective action request

What This Template Covers

This template produces a complete failure analysis report linking physical evidence to root cause with assigned corrective actions.

  • Electrical characterization data: curve trace, parametric, thermal, X-ray results
  • Physical inspection findings: SEM/EDS images, cross-sections, decap, acoustic microscopy
  • Root cause determination, corrective actions, disposition, and chain-of-custody documentation

Common Pitfalls to Avoid

Most failure reports fail by speculating without evidence, omitting traceability, or skipping verification of corrective actions.

  • Claiming root cause before completing physical analysis or testing
  • Missing lot numbers, date codes, or chain-of-custody documentation
  • Assigning corrective actions without owners, timelines, or verification criteria

Template Structure

What the Failure Analysis Report Template Includes

Use this semiconductor & electronics template as a starting point, then customize each section to match your internal workflow, evidence, and signoff needs.

1

Failure Summary

State failure mode, source, customer or lot reference, symptom, quantity affected, and urgency.

2

Sample Information

List device, package, date code, lot, serial numbers, handling condition, and chain of custody.

3

Electrical Findings

Summarize curve trace, ATE retest, bench measurement, thermal, or X-ray screening results.

4

Physical Analysis

Document decapsulation, cross-section, SEM/EDS, acoustic microscopy, dye-and-pry, or microscopy evidence.

5

Root Cause

Link the confirmed or most probable cause to evidence and reject unsupported hypotheses.

6

Corrective Actions

Assign containment, process correction, design update, supplier action, and verification owners.

7

Disposition

State return, scrap, rework, customer response, and retained evidence location. Keep the report factual, concise, and traceable to tested evidence.

Recommended Structure

Write a semiconductor/electronics failure analysis report. Structure with these Markdown sections:

Failure Summary

State failure mode, source, customer or lot reference, symptom, quantity affected, and urgency.

Sample Information

List device, package, date code, lot, serial numbers, handling condition, and chain of custody.

Electrical Findings

Summarize curve trace, ATE retest, bench measurement, thermal, or X-ray screening results.

Physical Analysis

Document decapsulation, cross-section, SEM/EDS, acoustic microscopy, dye-and-pry, or microscopy evidence.

Root Cause

Link the confirmed or most probable cause to evidence and reject unsupported hypotheses.

Corrective Actions

Assign containment, process correction, design update, supplier action, and verification owners.

Disposition

State return, scrap, rework, customer response, and retained evidence location.

Keep the report factual, concise, and traceable to tested evidence.

Example Filled Template

Failure Analysis Report - Gate Driver U17

Failure Summary

Symptom: No high-side output on customer board return RMA-4219.
Quantity: 2 failed units from date code 2614A.

Electrical Findings

ATE retest confirmed leakage on HO pin above 2 mA at 12 V. Curve trace showed low impedance to VS.

Physical Analysis

Decapsulation found EOS damage near the HO bond pad. SEM showed localized metal melt with no bond lift.

Root Cause

Probable electrical overstress during board-level inductive load switching. No fab defect evidence was found.

Disposition

Retain Unit 2 cross-section samples in FA cabinet shelf B for customer review.

Video to Document

Turn Video Into Failure Analysis Report

Already have a walkthrough or training video covering this process? Skip manual drafting. Upload the video and Docsie AI generates failure analysis report template with every required field populated — ready for review, signoff, or export.

Use the template manually, or let Docsie generate the first draft from source footage.

DOCX, PDF, and Markdown downloads
Works with process and training videos

Template FAQ

Failure Analysis Report Template FAQ

Common questions about downloading and generating a failure analysis report template.

Using This Template

Q: What is a failure analysis report template?

A: A failure analysis report template is a structured document for document electrical, physical, and root cause analysis for failed devices or assemblies.

Q: Is the failure analysis report template really free?

A: Yes. The failure analysis report template is completely free to download in Word (DOCX), PDF, and Markdown formats. No signup or credit card required to download.

Q: How do I turn a video into a failure Analysis Report?

A: Upload a process walkthrough, training recording, or screen capture to Docsie. The AI analyzes the video and generates a complete failure Analysis Report using this template's structure — every required field auto-filled from the footage.

Q: Can I edit the failure analysis report template after downloading?

A: Yes. The DOCX format opens in Microsoft Word or Google Docs. The Markdown format imports into Notion, Confluence, Docsie, or any markdown editor. Customize fields, add your branding, and adapt to your internal workflow.