Assembly Traveler

Use this template to track die attach, wire bond, mold, singulation, inspection, and release steps for IC assembly.

Template Metadata

Lot Header

Identify assembly lot, device, package, quantity, priority, route revision, and owner.

Notes

[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]

Material Traceability

List wafer lot, leadframe or substrate, epoxy, wire, mold compound, and consumable batch numbers.

Notes

[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]

Assembly Flow

Table operation, equipment, recipe, setup verification, required data, and signoff.

Notes

[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]

Inspection Gates

Define die attach, wire bond, mold, x-ray, visual, and final inspection criteria.

Notes

[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]

Process Holds

List mandatory quality, engineering, or customer holds and release authority.

Notes

[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]

Rework Rules

State allowed rework loops, scrap triggers, and documentation requirements.

Notes

[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]

Release

Specify final count reconciliation, data upload, and move-to-test criteria. Use package assembly terminology and clear lot traceability fields.

Notes

[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]

Review and Signoff

Document review conclusions, approvals, unresolved items, and next review date.