Wafer Sort Procedure

Use this template to define probe setup, wafer sort execution, binning, data handling, and hold criteria.

Template Metadata

Scope

Identify device, wafer technology, sort insertion, test program, and applicable lot types.

Notes

[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]

Equipment Setup

List prober, tester, load board, probe card, chuck temperature, and required calibrations.

Notes

[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]

Probe Card Checks

Define cleaning, alignment, contact resistance, touchdown limits, and maintenance triggers.

Notes

[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]

Sort Execution

Provide step-by-step lot load, wafer map verification, first wafer review, and production flow.

Notes

[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]

Binning Rules

Describe pass bins, fail bins, retest bins, inkless map rules, and engineering bins.

Notes

[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]

Data Handling

Specify STDF, wafer map, MES upload, backup, and customer data package requirements.

Notes

[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]

Hold Criteria

List yield, continuity, probe mark, temperature, and equipment alarms requiring lot hold. Use probe and ATE terminology with auditable setup values.

Notes

[Add context, assumptions, exceptions, evidence links, screenshots, calculations, or reviewer comments.]

Review and Signoff

Document review conclusions, approvals, unresolved items, and next review date.